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Sengong @ here the 2018 Xiamen international tea package & design fair

Sengong @ here the 2018 Xiamen international tea package & design fair

  • 2018/11/02

Fair:   2018 Xiamen internation tea package & design fair

Date: 18th-22th,Oct,2018

Welcome you can come and visit our booth no A3T091

Address:  Xiamen international convention and exhibition center in China


The total exhibition area of this session is 75,000square meters,with total  of 3800 booths and enterprises both at home and and abroad.

Sengong starts to exhibit in the Tea fair from 2010,and has successfully taken part in 8 session since.

Sengong,pursuing constant quality,having professional staffs,and offering throughtful service,has stood out among the exhibitors and are highly praised by the customers in this exhibition


C21 pyramid tea bag machine with outer envelope:





C19D drip coffee filling and sealing machine:





C20 tea bag packaging machine:







C18 tea packet packaging machine:



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